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US Patent Issued to Qorvo US on June 30 for "Die attach system" (Texas Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,561, issued on June 30, was assigned to Qorvo US Inc. (Greensboro, N.C.). "Die attach system" was invented by Walid Meliane (Plano, Texas) ... और पढ़ें


US Patent Issued to Intel on June 30 for "Cavity-less interconnect component on glass core" (Arizona Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,562, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Cavity-less interconnect component on glass core" was invented ... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Package substrate with branch line patterns and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,563, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Package substrate with branch line patterns ... और पढ़ें


US Patent Issued to Intel on June 30 for "Technologies for vertically interconnected glass core architecture" (Arizona Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,564, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Technologies for vertically interconnected glass core architect... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Package substrate and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,565, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Package substrate and semiconductor package ... और पढ़ें


US Patent Issued to Intel on June 30 for "Wireless chip-to-chip high-speed data transport" (California, Washington, Oregon, Arizona Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,566, issued on June 30, was assigned to Intel Corp. (Santa Clara, Calif.). "Wireless chip-to-chip high-speed data transport" was invented b... और पढ़ें


US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Printed circuit board, semiconductor package, and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,567, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Printed circuit board, semiconductor package... और पढ़ें


US Patent Issued to Sandisk Technologies on June 30 for "Substrate having an increased metal trace thickness" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,568, issued on June 30, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.). "Substrate having an increased metal trace thickness"... और पढ़ें


US Patent Issued to MINEBEA POWER SEMICONDUCTOR DEVICE on June 30 for "Power semiconductor module and power conversion device" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,569, issued on June 30, was assigned to MINEBEA POWER SEMICONDUCTOR DEVICE INC. (Ibaraki, Japan). "Power semiconductor module and power con... और पढ़ें


US Patent Issued to Rohm on June 30 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,570, issued on June 30, was assigned to Rohm Co. Ltd. (Kyoto, Japan). "Semiconductor device" was invented by Kohei Tanikawa (Kyoto, Japan).... और पढ़ें